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Chip Industry Technical Paper Roundup: Sept. 8
HBF for LLM inference; M3D SRAM with BEOL pass-gates at 2nm; distributed GPU architectures; hybrid HBM-HBF memory; GaN-on-silicon polarization superjunctions; programmable silicon photonics; Al dopant activation in 4H-SiC. The post Chip Industry Technical Paper Roundup: Sept. 8 appeared first on Semiconductor Engineering .